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| ICX084AL Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX084AL is a diagonal 6mm (Type 1/3) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive scan allows all pixels signals to be output independently within approximately 1/30 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as twodimensional bar code readers, PC input cameras, etc. 16 pin DIP (Plastic) Features Pin 1 * Progressive scan allows individual readout of the image signals from all pixels. * High vertical resolution (480 TV-lines) still image V without a mechanical shutter. * Square pixel unit cell * Supports VGA format * Horizontal drive frequency: 12.27MHz 2 * No voltage adjustments (reset gate and substrate 31 H Pin 9 bias are not adjusted.) * High resolution, high sensitivity, low dark current Optical black position * Continuous variable-speed shutter (Top View) 1/30 (Typ.) to 1/10000s * Low smear * Excellent antiblooming characteristics * Horizontal register: 5V drive * 16-pin high precision plastic package (enables dual-surface standard) Device Structure * Interline CCD image sensor * Image size: * Number of effective pixels: * Total number of pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 2 8 Diagonal 6mm (Type 1/3) 659 (H) x 494 (V) approx. 330K pixels 692 (H) x 504 (V) approx. 350K pixels 5.84mm (H) x 4.94mm (V) 7.4m (H) x 7.4m (V) Horizontal (H) direction Front 2 pixels, rear 31 pixels Vertical (V) direction Front 8 pixels, rear 2 pixels Horizontal 16 Vertical 5 Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E95307E99 ICX084AL Block Diagram and Pin Configuration (Top View) VOUT GND CGG GND V1 V2 2 8 7 6 5 4 3 Vertical register Note) Horizontal register Note) 9 10 11 12 13 14 15 16 : Photo sensor SUBCIR GND SUB VDD Pin Description Pin No. 1 2 3 4 5 6 7 8 Symbol V3 V2 V1 NC GND CGG GND VOUT GND Output amplifier gate1 GND Signal output Description Pin No. 9 10 11 12 13 14 15 16 Symbol VDD SUBCIR GND SUB VL RG H1 H2 H1 H2 RG VL V3 1 NC Description Supply voltage Supply voltage for the substrate voltage generation GND Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock 1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1000pF or more. Absolute Maximum Ratings Item Substrate clock SUB - GND Supply voltage VDD, VOUT, CGG, SUBCIR - GND VDD, VOUT, CGG, SUBCIR - SUB V1, V2, V3 - GND V1, V2, V3 - SUB Ratings -0.3 to +36 -0.3 to +18 -22 to +9 -15 to +16 to +10 to +15 to +16 -16 to +16 -10 to +15 -55 to +10 -65 to +0.3 -0.3 to +27.5 -0.3 to +20.5 -0.3 to +17.5 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V V V C C 2 Remarks Clock input voltage Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins H1, H2 - V3 H1, H2 - GND H1, H2 - SUB VL - SUB V2, V3 - VL RG - GND V1, H1, H2, GND - VL Storage temperature Operating temperature 2 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -2- ICX084AL Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Symbol VDD VL SUB Min. 14.55 Typ. 15.0 1 2 Max. 15.45 Unit Remarks V 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Set SUBCIR pin to open when applying a DC bias to the substrate clock pin. DC Characteristics Item Supply current Symbol IDD Min. Typ. 6 Max. 8 Unit mA Remarks Clock Voltage Conditions Item Readout clock voltage VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 V1, V2, V3 Vertical transfer clock voltage I VVL1-VVL3 I VVHH VVHL VVLH VVLL Horizontal transfer clock voltage VH VHL VRG Reset gate clock voltage VRGLH - VRGLL VRGH Substrate clock voltage VSUB VDD +0.4 21.5 VDD +0.6 22.5 4.75 -0.05 4.5 5.0 0 5.0 Symbol Min. 14.55 -0.05 -0.2 -8.0 6.8 Typ. 15.0 0 0 -7.5 7.5 Max. 15.45 0.05 0.05 -7.0 8.05 0.1 1.0 2.3 1.0 1.0 5.25 0.05 5.5 0.8 VDD +0.8 23.5 Unit V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Input through 0.01F capacitance Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL1 + VVL3)/2 VVH = VVH02 Remarks -3- ICX084AL Clock Equivalent Circuit Constant Item Symbol CV1 Capacitance between vertical transfer clock and GND CV2 CV3 CV12 Capacitance between vertical transfer clocks CV23 CV31 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor CH1, CH2 CHH CRG CSUB R1, R2 R3 RGND RH1, RH2 RRG Min. Typ. Max. Unit Remarks 560 470 1500 1500 1500 1000 43 39 5 570 20 56 43 10 39 pF pF pF pF pF pF pF pF pF pF V1 R1 CV12 CV1 RGND CV2 R2 V2 RH1 H1 CHH RH2 H2 Cv31 CV3 Cv23 CH1 CH2 R3 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG RG CRG Reset gate clock equivalent circuit -4- ICX084AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II M VVT 10% 0% tr twh tf 0V M 2 Note) Readout clock is used by composing vertical transfer clocks V2 and V3. (2) Vertical transfer clock waveform V1 VVHL VVH1 VVHH VVH VVLH VVL01 VVL1 VVLL V2 VVH02 VVHH VVHL VVH2 VVH VVL VVLH VVL2 VVLL V3 VVHL VVH3 VVHH VVH VVL VVL03 VVLL VVLH VVL VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03 VV1 = VVH1 - VVL01 VV2 = VVH02 - VVL2 VV3 = VVH3 - VVL03 -5- ICX084AL (3) Horizontal transfer clock waveform H1, H2 tr twh tf 90% VH 10% VHL twl (4) Reset gate clock waveform RG tr twh tf VRGH twl RG waveform Point A VRG VRGL + 0.5V VRGLH VRGL VRGLL H1 waveform 2.5V VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL (5) Substrate clock waveform SUB 100% 90% M VSUB 10% VSUB 0% (A bias generated within the CCD) M 2 tf tr twh -6- ICX084AL Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock During imaging Symbol VT V1, V2, V3 H1 H2 H1 H2 RG SUB 11 13 62.5 24 30 25 31.5 25 30 10 17.5 10 0.01 0.01 3 0.5 15 twh twl tr tf Unit s 350 ns 10 17.5 ns 26.5 31.5 10 0.01 s 0.01 3 ns 0.5 s During drain charge 15 Remarks During readout 1 Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 0.5 2 During parallel-serial conversion Reset gate clock Substrate clock 1.5 1.8 1 When vertical transfer clock driver CXD1267AN is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least 2.5V. two Item Symbol Min. Typ. Max. Unit ns Remarks 3 Horizontal transfer H1, H2 21.5 25.5 clock 3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. -7- ICX084AL Image Sensor Characteristics Item Sensitivity Saturation signal Smear Video signal shading Dark signal Dark signal shading Lag Symbol S Vsat Sm SH Vdt Vdt Lag Min. 540 500 0.005 0.015 20 25 4 1 0.5 Typ. 700 Max. Unit mV mV % % % mV mV % Measurement method 1 2 3 4 4 5 6 7 (Ta = 25C) Remarks Ta = 60C Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Zone Definition of Video Signal shading 659 (H) 12 12 12 H 8 V 10 H 8 494 (V) Zone 0, I Zone II, II' V 10 10 Ignored region Effective pixel region Measurement System CCD signal output [A] CCD C.D.S AMP S/H Signal output [B] Note) Adjust the amplifier gain so that the gain between [A] and [B] equals 1. -8- ICX084AL Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [B] of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance : 706cd/m2, color temperature of 3200K halogen source) as a subject. (pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (VS) at the center of the screen, and substitute the value into the following formula. S = VS x 250 [mV] 30 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Vsm [mV]) of the signal output and substitute the value into the following formula. Sm = Vsm 1 1 x x 150 500 10 x 100 [%] (1/10V method conversion value) 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/150 x 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. -9- ICX084AL 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 7. Lag Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%] VD V2 Light Strobe light timing Signal output 150mV Output Vlag (Lag) - 10 - Drive Circuit 15V 1 19 18 17 16 15 14 13 22/16V 1000p 1/35V 0.1 3.3/16V 20 100k 2 3 XSUB 4 XV1 5 -7.5V XV2 6 CXD1267AN 7 XSG 8 12 11 XV3 9 10 V3 V2 V1 NC CGG GND GND VOUT H2 H1 RG VL SUB GND SUBCIR H2 16 15 14 13 12 11 10 9 2200p 1M H1 1/20V 100k VDD - 11 - 1 2 3 4 5 6 0.01 22/20V 7 8 100 CCD OUT 3.9k ICX084 ( BOTTOM VIEW ) 2SK523 0.01 3.3/20V RG ICX084AL ICX084AL Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics) 1.0 0.9 0.8 0.7 Relative Response 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 500 600 700 Wave Length [nm] 800 900 1000 Sensor Readout Clock Timing Chart XSG XV1 XV2 XV3 Sensor readout clock XSG is used by composing XV2 and XV3. HD 42.4s (520 bits) V1 V2 V3 2.53s (31 bits) 2.04s (25 bits) - 12 - Drive Timing Chart (Vertical Sync) VD HD 7 14 15 V1 V2 V3 123456781234 494 123 CCD OUT 525 1 508 510 525 1 7 - 13 - ICX084AL Drive Timing Chart (Horizontal Sync) HD/SYNC 78 1 BLK 35 107 123 125 132 CLK 35 1 72 1 16 1 RG SHP SHD 1 36 1 1 1 1 36 1 1 24 36 1 12 12 36 24 V1 V2 V3 H1 23 1 12 H2 1 1 37 SUB 1 780 1 - 14 - ICX084AL ICX084AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 50N Plastic package Compressive strength 50N 1.2Nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 15 - ICX084AL c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. - 16 - Package Outline Unit: mm 16pin DIP (450mil) A 0 to 9 6.1 9 16 D ~ 2.5 C 11.43 8.4 5.7 V 2-R0.5 ~ 2.5 H 9.5 11.4 0.1 0.5 B' 3.1 0.3 M 1.27 3.5 0.3 - 17 - 1.2 2.5 1. "A" is the center of the effective image area. 3.35 0.15 9.2 ~ 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (6.1, 5.7) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 50m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 50m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. 0.69 1.27 0.46 0.3 (For the first pin only) PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY ICX084AL PACKAGE WEIGHT 0.9g 0.25 1.2 11.6 10.3 12.2 0.1 8 1 2.5 B |
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